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Tips Thin Substrate, 50-75mm
Handling-Shipping » Manual Handling » Vacuum Wands » H-SQUARE » List » HSQ-T794PKAS
Handling-Shipping » Manual Handling » Vacuum Wands » H-SQUARE » List » HSQ-T794PKAS
Special Application Handling Tips, e.g. MEMS/Thin Wafer:
Thin, one piece molded press-fit tips for general handling of thin or ultra fragile substrates 2"-3" in diameter (0.005" - 0.015" thick).
Molded from rigid carbon filled PEEK for strength, chemical resistance and ESD protection.
Excellent adhesion to wafers with minimum distortion or stress to the substrate.
Applications included handling of lager size ultra fragile substrates (e.g., GaAs, GN, SiGe, InGaP, etc.).
Ideal for MEMS wafers where ultrathin geometries can be damaged with standard vacuum tips.
For use with NOASPF2 Press-Fit Style Vacuum Wand.
