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Process box for electrophoretic dep. PLUS/GII, PTFE Frame, with Glass Lid
Wetprocess » Processing » Processing: Holder, Single Wfr » SILICET » List » SIL-PLUS/GII
Wetprocess » Processing » Processing: Holder, Single Wfr » SILICET » List » SIL-PLUS/GII
Wafer Processing Box for Electrophoretic Depositions:
A resist coating process using the SILICET-PROCESS-BOX-PLUS Type FR.
- The resist expense is minimal, due to the small coating chamber.
- No external contact with resist possible.
- No additional resist removal at the edge of the wafer.
- No further wafer cleaning on the wafer backside necessary.
- Using the SILICET-PROCESS-BOX-PLUS-FR guarantees wafer processing in a closed an hence protected coating room.
- Optimal energy operation due to small resist quantities.
Additional cost aspects:
Optimalization of the expensive resist. Only small resist quantities in circulation. Process time saving, because no wafer back side cleaning is necessary.
Models for 4", 6" wafers.







