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The OAI Model 200 Mask Alignment and UV Exposure System is a cost-effective high performance tool that has been engineered with the industry proven components that have made OAI a leader in the semiconductor photolithography capital equipment industry. The Model 200 is a bench top tool that requires minimal clean room space. It offers an economic alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photomask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.

The alignment module features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z axis. The Model 200-IR Aligner can be fitted with backside IR. The IR illumination vacuum chuck can be configured for alignment of whole wafers or pieces.

The Model 200 features a dependable OAI light source that provides collimated UV light in Near or Deep UV using lamps ranging in power from 200 to 2000 watts. Dual-sensor, optical feedback loops are linked to the constant intensity controller to provide control of exposure intensity within ±2% of the desired intensity. Changes may be made to the UV wavelength quickly and easily. The Model 200 is a flexible, economic solution for any entry level mask alignment and UV exposure application.

FEATURES AND SPECIFICATIONS

• High Efficiency, Extremely Uniform, Light Source Systems
• Easily Interchangeable Mask Holders and Chucks
• Up to 8" diameter substrate capability
• Zero alignment shift when moving to expose position
• Non-Contact, Soft Contact & Soft-through-Hard Vacuum Contact
• Numerous Alignment Optics Options
• IR Backside Alignment Option, Single or split-field
• High Reliability, Low Maintenance Design
• Simple, Manual operation