List

The OAI Model 2000 may be configured as either an edge-bead exposure tool or a flood exposure system; both configurations are based on a proven, time-tested platform.

The OAI 2000SM Edge-bead Exposure System provides a cost-effective method for edge-bead removal using standard shadow mask technology. Mask and substrate changeover can be accomplished quickly and easily adding to the versatility as well as throughput of this high volume production tool.

The Model 2000 systems include a UV lightsource, intensity controlling power supply and robotic substrate handling subsystem. UV lightsources provide adjustable intensity beams with divergence half-angles of <2.0%. Power supplies are available from 200W to 2,000W. Intensity controller sensors are linked directly to the lightsource for accurate intensity monitoring. The OAI robotic substrate handling system is microprocessor controlled and may be programmed to accommodate a wide variety of substrate sizes. The shadow mask capability enables the user to pattern the top-side of a substrate while being held in very close proximity to the mask. At a separation of 25 microns, these systems are capable of 6 micron resolution.

FEATURES AND SPECIFICATIONS

• System throughput is independent of exposure pattern complexity.
• Entire wafer is exposed at one time.
• Changing the exposure pattern is as simple as changing the mask.
• Changeover (including mask alignment) takes only ten minutes.
• After initial alignment, system processes remaining wafers automatically.
• The system has only one moving component.
• Uniform, Repeatable exposures.
• Intensity controlling power supply drives the UV exposure system.
• System is easy to operate and requires very little maintenance.