Chemical mechanical polishing CMP has become the best choice for global and local planarization. Global planarization which is essential to produce a multilevel integrated circuit IC device, is achieved by reducing the topography variation at the wafer scale. Without CMP, it would be impossible to fabricate complex, dense, and miniaturized IC devices. During the past decades, CMP has significantly advanced both in the development of sophisticated processing tools and in the formulation of slurries.
SPS-Europe offers an established portfolio of products supporting the CMP process. Including Slurry Mixing Systems, a variety of pumps, retaining rings and other CMP consumables. When coupled with our post-CMP cleaning products, our solutions provide leading-edge cleaning performance.