The VS-1TM vibration sensor was used to detect the vibration of the Pad Conditioner arm. The yellow arrow Y indicates the sweeping movement of the PC Arm.
Readings show Z-axis vibration to be high at the centre of the pad. Follow-up investigation found that the High Pressure Rinse DIW nozzle spray was weak at the pad centre area. This will lead to low cleaning efficiency at pad centre area and induce pad glazing and microscratch issu.
1. FI robot moving to ready position (pick up slot position) (Z-axis motion)
2. Robot blade extends into FOUP (X-axis motion. Plunger will retract during start of this step)
3. Robot blade picks up the wafer (Z-axis motion, wafer lifted up from the slot and plunger extends to hold the wafer)
4. Robot blade retracts from FOUP (X-axis motion, wafer retrieval action completed)
© 2017 SPS Europe, Inc. All Rights Reserved.