Vibration Sensors

Vibration Sensors for CMP Tool or on robot arm

Can you detect tool deterioration on time?

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Diagnostic for tool integration   Monitor trends of vibration sensor conditions  Detect dynamic problems

VS-Series Vibration Sensors provide advanced warning when semiconductor machines conditions are deteriorating, allowing engineers to take preventive action and avoid failure and losses.
Frequently Asked Questions about the Vibration Sensors >

Watch the Vibration Sensor Semiconductor Robotic Arm movie here or watch the Vibration Sensor Pad Con movie here
Our vibration sensors for semicondutor systems features:
Fingertip-size sensor head allows for easy fitting:
  • Measuring 3 axis (X, Y, Z)
  • High output data >800 measurements/sec
  • Simple and convenient USB plug-n-use operation
  • Seamless integration via SECS / GEM
  • Tool integration or mobile use, on/off-line monitoring with vibration sensor
If healthcare could be just as simple: Realtime monitoring of machine health condition with the VS-2SI Online vibration sensor monitoring!

Semiconductor CMP Tool
Pad conditioner (PC) arm vibration sensors behaviour

The VS-1TM vibration sensor was used to detect the vibration of the Pad Conditioner arm. The yellow arrow Y indicates the sweeping movement of the PC Arm.

Readings show Z-axis vibration to be high at the centre of the pad. Follow-up investigation found that the High Pressure Rinse DIW nozzle spray was weak at the pad centre area. This will lead to low cleaning efficiency at pad centre area and induce pad glazing and microscratch issu.

SEM images of pore-type pad surface and glazed surface of the same pad.
Data logged by VS-1 @ 800Hz

Robot handling - Data logged by VS-1 vibration sensors

Semiconductor Robot handling FI robot wafer retrieval motion - vibration sensors

1.  FI robot moving to ready position (pick up slot position) (Z-axis motion)
2.  Robot blade extends into FOUP (X-axis motion. Plunger will retract during start of this step)
3.  Robot blade picks up the wafer (Z-axis motion, wafer lifted  up from the slot and plunger extends to hold the wafer)
4.  Robot blade retracts from FOUP (X-axis motion, wafer retrieval action completed)