SAESOL

Saesol Diamond Industrial is a world leading manufacturer of CMP Pad Conditioner. Saesol produces a wide variety of Pad Conditioners for all CMP process tools, providing lower cost of ownership and improved process results. Saesol Conditioners have been tested and proven by major semiconductor manufacturers throughout the US, Europe and Asia.

Saesols quality control procedures insure products that consistently meet your performance specifications. Saesol is committed to continuous improvement in all aspects of company operations to maintain the highest standards in workmanship and quality products.

Saesol Diamond Disks are tested and proven in production by major semiconductor manufacturers in USA, Europe, Taiwan and Korea. Applied Materials, Ebara, Strasbaugh, IPEC and Lam, as well as Customized Pad Conditioners can be ordered to meet any CMP application.

Main activities:
CMP Pad Conditioners (Diamond Disks)
Products
Wetprocess
Pad Conditioners
SAESOL
 
CLC CONDITIONER

Wetprocess » CMP » Pad Conditioners
4,25" CLC PAD CONDITIONER is consumable for removal of polyurethane pad surface clogging. Our CMP disks are available for all CMP production platforms.
4,25"
CMP Process Buffing, CMP Process Barrier, CMP Process Poly, CMP Process SOH
SST - Diamond-Nickel Bonding
Wetprocess
Pad Conditioners
SAESOL
 
RING

Wetprocess » CMP » Pad Conditioners
4,25" RING PAD CONDITIONER is consumable for removal of polyurethane pad surface clogging. Our CMP disks are available for all CMP production platforms.
4,25"
CMP Process ILD, CMP Process STI, CMP Process Metal
SST - Diamond-Nickel Bonding
Wetprocess
Pad Conditioners
SAESOL
 
CVD CONDITIONER

Wetprocess » CMP » Pad Conditioners
4,25" CVD PAD CONDITIONER is consumable consumable that uses CVD method to prevent diamond from shedding and minimize performance difference among products
4,25"
CMP Process ILD, CMP Process STI, CMP Process Metal, CMP Process TSV, CMP Process Buffing, CMP Process Barrier, CMP Process Poly, CMP Process Gate
SST - CVD Diamond Coating
Handling-Shipping
Diamond Wire
SAESOL
 
Diamond Wire (Sunlight)

Handling-Shipping » Grinding / Dicing » Diamond Wire
A diamond tool used in the wire-sawing step as part of the semiconductor wafering process; The main function is for slicing sapphire and silicon ingot.
Sunlight
100~140µm
Ingot Slicing
Wetprocess
Pad Conditioners
SAESOL
 
SR

Wetprocess » CMP » Pad Conditioners
4,25" SR PAD CONDITIONER is consumable for removal of polyurethane pad surface clogging. Our CMP disks are available for all CMP production platforms.
4,25"
CMP Process STI, CMP Process Metal
SST - Diamond-Nickel Bonding
Wetprocess
Pad Conditioners
SAESOL
 
LPX

Wetprocess » CMP » Pad Conditioners
4,25" LPX PAD CONDITIONER is consumable for removal of polyurethane pad surface clogging. Our CMP disks are available for all CMP production platforms.
4,25"
CMP Process STI, CMP Process Metal
SST - Diamond-Nickel Bonding
Wetprocess
Pad Conditioners
SAESOL
 
BAR

Wetprocess » CMP » Pad Conditioners
4,25" Pad Conditioner BAR consumable for removal of polyurethane pad surface clogging. Our CMP disks are available for all CMP production platforms.
4,25"
CMP Process ILD, CMP Process STI, CMP Process Metal
SST - Diamond-Nickel Bonding
Wetprocess
Pad Conditioners
SAESOL
 
Standard

Wetprocess » CMP » Pad Conditioners
4,25" STANDARD PAD CONDITIONER is consumable for removal of polyurethane pad surface clogging. Our CMP disks are available for all CMP production platforms
4,25"
CMP Process ILD, CMP Process STI, CMP Process Metal
SST - Diamond-Nickel Bonding