Anti-Static Ultraviolet adhesive film for direct lamination to the wafer backside. Ideal for thin/fragile wafer dicing. The base film is of Polyolefin with an Acrylic adhesive containing photoactive component. When exposed to UV engergy the adhesive properties decrease significantly, resulting in easy removal of the film with virutally NO STRESS being applied to the wafer.
- Negative charge build-up is dissipated with our Antistatic layer
- Same demanding film properties as our standard UV film
- Selection of Antistatic UV film available for varying needs and requirements
Supplied in 100-meter (330 ft.) rolls with PET backing liner
Available in following standard widths:
7", 8", 9", 10", 11", 12"