For moving single 12" (300mm) wafers betwee two SEMI standard FOUP, FOSB or MC12-25HC metal bake-out cassettes. Operator opens FOUP manually, rotates into position. User-friendly FPD touch screen software - select recipe or manual mode to move a single or multiple wafers between carriers. This system does not offer OCR / Alignment capabilities. Targeted for cost sensitive applications like R&D, test-assembly-packaging and application labs.
- For up to 12" (300mm) Wafers
- Single Wafer FOUP to FOSB Transfer
- Compatible with H-Square Metal Cassettes
- Automatic System
- No OCR / Alignment Capabilities
- Class 1 Cleanroom Compatible
- Facilities: 120 V / 220 V Power