12" (300mm) Low Contact Transfer System - Automatic (FOUB / FOSB)

Part number: LCT1AS12-AC-003
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Specifications

Part number
LCT1AS12-AC-003
TAG 1
12" (300mm)
TAG 2
Automatic System
TAG 3
With Rotating Base

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Low Contact Transfer

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Product description

12" (300mm) Low Contact Transfer System - Automatic (FOUP / FOSB)

Model: LCT1AS12-AC-003 (with Rotating Base)

12" (300mm) Low Contact Transfer machine provides safe means of mass transferring wafers from cassette to cassette. Wafers are gently lifted midpoint in the cassette slots before extracting or the cassette which could cause particulation. Safety sensor detects wafers in the pod. A wafer mapper detects cross slotted wafers. User-friendly fail-safe operation features simple one-button actuation. Small footprint saves valuable cleanroom space. Sturdy construction assures high reliability and robustness required in high throughput fabs. Unit is compatible with SEMI standard FOUPs and FOSBs and SEMI standard metal cassettes like MC12-25HC1. Class 1 cleanroom compatible. ESD-Safe construction.

Specifications:
  • For 12" (300mm)
  • Low Contact Transfer
  • Automatic System
  • Wafer Contact Material: Kynar PVDF
  • ESD-Safe
  • With Rotating Base
  • USA 100-120 VAC
  • Class 1 Cleanroom Compatible

Applications:
  • FOSB to FOUP (Mass Transfer)
  • FOUP to FOUP (Mass Transfer)
  • FOUP to Metal Cassette (Mass Transfer)

Dimensions:
  • Height: 20" (508mm)
  • Depth: 35" (889mm)
  • Width: 16" (406mm)