8" (200mm) Low Contact Transfer System - Automatic

Part number: LCT1AS8
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Specifications

Part number
LCT1AS8
TAG 1
8" (200mm)
TAG 2
Automatic System
TAG 3
Horizontal Transfer

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Product description

8" (200mm) Low Contact Transfer System (Automatic)

Model: LCT1AS8

Low contact transfer machine provides a safe means of mass transferring wafers from cassette to cassette. Wafers are gently lifted midpoint in the cassette slots before extracting or loading them to minimize contact with the cassette which could cause particulation or wafer edge chipping. Optical and mechanical sensors combined with software logic guard against operation errors such as trying to transfer wafers into a cassette which is already loaded with wafers. User-friendly fail-safe operation features simple one-button actuation. Sturdy construction assures high reliability and robustness required in high throughput fabs. Small footprint saves valuable cleanroom space. Additional substrate sizes are available. Ultra thin wafer versions available (< 220 microns).

Specifications:
  • For 8" (200mm) Wafers
  • Wafer Transfer System
  • Automatic System
  • For Standard, Thin and Compound Wafer Applications
  • Material Stage: Teflon Coated Hard Black Anodized
  • Material Transfe Rod: Kynar PVDF
  • Material Cassete Positioners: ESD-Safe PEEK
  • Facilities: 120/240V AC, 5 amp
  • Available with EU of UK Power Supply

Applications:
  • Plastic to Plastic, Plastic to Metal, Metal to Plastic, Mass Tranfers
  • Thin Wafer Transferring
  • Compound (fragile) Wafer Transferring
  • Wafer Inverting (180° reorientation), H-Bar Up or Down
  • Class 1 Transfer Applications
  • Transferring between two cassettes with different D1 dimensions

Dimensions:
  • Height: 12" (304mm)
  • Depth: 23" (584mm)
  • Width: 10" (254mm)

*** NOTE: Please specify cassette model number(s) when ordering ***
(Of both the 'Send' and the 'Receive' Cassette)