K-PRO™ Advanced Packaging Thick

Part number: K-PRO
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Specifications

Part number
K-PRO
TAG 1
Positive Photoresist
TAG 2
5-50 µm FT
TAG 3
Advanced Packaging
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Documentation

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Product description

K-PRO™ photoresists are advanced packaging positive resists for use in i-line, g-line and broadband packaging applications. They are compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO™ positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications.
 

  • Cover 5 – 25 µm in a single coat
  • Double-coat process available for up to 50 microns
  • Designed for use with metal-ion or metal-ion free developers
  • No PEB required