UH119 Pressure Cleaning System

Part number: UH119
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Specifications

Part number
UH119
TAG 1
Up to 12" (300mm)
TAG 2
Semi-Automatic

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Product description

UH119 Pressure Cleaning System

Features:
  • Up to 8" (200mm) frame-mounted wafer capability
  • Compact, small footprint floor-standing profile
  • Fast and efficient cleaning is optimized through user programmable sequences
  • Easily programmable microprocessor-based controller
  • Repeatable, reliable, semiautomatic operation
  • Exceptional cost/performance value

Specifications:
  • Power: 115V/10A, 240V/5A
  • Air: 6.2 l/min @ 60 psi
  • Water: 1.5 l/min @ 25 psi
  • Spindle Speed: 100 - 3.200 RPM (adjustable)
  • Wafer offset: +/- 5° (20mm)

Dimensions:
  • Height: 48"
  • Width: 18"
  • Depth: 27"