Handling & Shipping

Product for safe substrate handling, transfer or sorting
of wafers. Solutions for shipping and storage of substrates.

ULTRON SYSTEMS

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ULTRON SYSTEMS Ultron offers a wide range of value-oriented manual to fully automatic semiconductor assembly equipment and one of the largest selections of semiconductor adhesive plastic film for dicing and backgrinding processes.

Main activities:
Backgrinding and UV tape
UV Curing
Handling-Shipping
Die Matrix Expander
ULTRON SYSTEMS
 
UH130 Die Matrix Expander

Handling-Shipping » Grinding / Dicing » Die Matrix Expander
Up to 8" (200mm)
Pneumatic
Optional: Motorized Cutter
Handling-Shipping
Die Matrix Expander
ULTRON SYSTEMS
 
UH130-12 Die Matrix Expander

Handling-Shipping » Grinding / Dicing » Die Matrix Expander
Up to 12" (300mm)
Pneumatic
Optional: Motorized Cutter